SUMMARY
This discussion focuses on selecting chip carriers and sockets suitable for low-temperature applications, specifically down to 4 K. Recommendations include CMR's LCC carriers and PLCC sockets by 3M, with caution advised against CMR's mP-body due to outgassing issues. Users emphasize the importance of thermal contact and matching thermal expansion coefficients to ensure reliable electrical connections. The consensus suggests that off-the-shelf components can often suffice unless specific low-outgassing or non-magnetic requirements are necessary.
PREREQUISITES
- Understanding of cryogenic temperatures and their effects on materials
- Familiarity with chip carriers and sockets, particularly LCC and PLCC types
- Knowledge of thermal expansion coefficients and their relevance in electronic applications
- Basic skills in PCB design and fabrication, including the use of Gerber files
NEXT STEPS
- Research the properties and applications of ceramic LCC carriers from EverGreen Semiconductor
- Explore the specifications and performance of PLCC sockets by 3M
- Investigate techniques for modifying sockets for improved thermal contact, such as using sapphire
- Learn about low-outgassing materials and their importance in vacuum environments
USEFUL FOR
Researchers and engineers working in cryogenics, particularly those involved in semiconductor applications, microwave technology, and low-temperature physics. This discussion is beneficial for anyone seeking to optimize sample mounting solutions in extreme environments.