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Engineering
Mechanical Engineering
Comparison of thermal shock profiles
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[QUOTE="berkeman, post: 6023968, member: 8921"] I'm assuming the Temperature is in degrees C and the Time is in minutes? (It's best to always label your axes with units to avoid ambiguity) :smile: The standard temperature stress profile that I'm familiar with (learned first at Hewlett Packard many years ago) is the STRIFE profile, which uses 10C/minute temperature ramps (hence liquid CO2 cooling is required for the ramps down), along with power cycling during the ramps and after soaking at the extremes of the profile. Using ramps faster than about 10C per minute can cause false failures, depending on how complex your electronics are, and going more slowly than 10C/minute doesn't really help you find all of the design and manufacturing issues that you would like to find in this kind of reliability testing. The profile that we typically use on medium-size Industrial temperature range products is shown below. The vertical cross-hatched bars show where the power to the UUTs is turned off. We typically also add in some off times during some of the temperature ramps. Are the ramp rates for the faster profile you show in your figure close to 10C/minute? [ATTACH=full]227849[/ATTACH] [/QUOTE]
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Comparison of thermal shock profiles
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