SUMMARY
The discussion focuses on identifying insulators with high dielectric strength at room temperature, specifically for applications requiring thin layers around 30 nm. Polysulfide sealants are suggested as a potential material. Additionally, the use of e-beam evaporation and atomic layer deposition techniques is emphasized for the deposition process. The importance of conducting experiments under oil to eliminate moisture is also highlighted.
PREREQUISITES
- Understanding of dielectric strength and its significance in materials science.
- Familiarity with e-beam evaporation techniques for thin film deposition.
- Knowledge of atomic layer deposition (ALD) processes.
- Basic principles of material properties under varying environmental conditions.
NEXT STEPS
- Research the properties and applications of Polysulfide sealants in electrical insulation.
- Explore the principles and advantages of e-beam evaporation for thin film applications.
- Investigate atomic layer deposition (ALD) techniques and their suitability for high dielectric strength materials.
- Study the effects of moisture on dielectric materials and methods to mitigate these effects.
USEFUL FOR
Materials scientists, electrical engineers, and researchers focused on developing high-performance insulators for electronic applications.