Hello, I'm new to this board, but I'd like to get some verification on an idea I'm working on. In 2001, Eneco, a company owned and operated by Professors at MIT, delivered their "Power Chip", a semiconductor structure that delivers to the solid state realm the powers of a vacuum tube thermal diode. However, their packaging technique has limited their ability to market the device. In the following 5 years, they still have not managed to make progress in this field. I believe I may have found a solution to their manufacturing trouble, but I need verification from outside sources. My idea is fairly basic. I want to rotate the diode interconnect assembly 90 degrees to bring it parallel to the substrate. This should make the process much easier to develop. Right now the device requires a laminating technique where the junctions are perpendicular to the substrate, which is very difficult to manufacture on such as small scale. I've included a couple pictures of broken open TECs (which use a perpendicular diode array manufacturing technique) as well as some lego designs of the new arrangement for visualization purposes. Please note that the final device would operate perpendicular to the heat source. Please check out the images at http://morlock.newdor.com/ Thank you for your time.