The forum discussion focuses on the need for comprehensive mathematical relations for the coupling of Electric, Thermal, and Structural physics, specifically referencing the Joule-Thomson effect and thermal stress/strain. The user seeks high-quality citations for their research paper and mentions a relevant paper titled "Electrical-Thermal Co-Simulation for DC IR-Drop Analysis of Large-Scale Power Delivery" by Tianjian Liu and Jian-Ming Jin, published in the IEEE Transactions on Components, Packaging and Manufacturing Technology. The discussion highlights a gap in detailed mathematical explanations within existing literature.
PREREQUISITESResearchers, engineers, and students involved in multidisciplinary fields such as electrical engineering, materials science, and thermal analysis, particularly those focusing on the integration of electric, thermal, and structural phenomena in their work.