By ground guarding, I mean surrounding the sensitive traces with ground pours. On the same layer, you will pour ground in the open spaces between the sensitive traces (and keep those traces apart from each other as much as practical). Keep the sensitive traces on the top layer with the switch ICs, and make your inner layer closest to the top layer your ground layer. That's usually your ground inner layer anyway, when you are running high-speed signals on the top layer between ICs, because you want to control your Zo geometry.
In your case, you are making that uppermost inner layer ground to help with the ground guarding. The top layer interstitial ground pours and the inner layer ground plane help to minimize the capacitance between the sensitive traces, which cuts the crosstalk down. The capacitance from a sensitive trace to ground dominates, compared to the capacitance between the sensitive traces.
It might also help to be sure that the sensitive signals are buffered individually before they are routed to the part of the PCB where the multiple analog switch ICs are. But that would only help if the signals were coming from a higher-impedance source, not if they are already coming from low-impedance buffers or amps.
Also be careful not to share any power or ground impedance between the separate signal sources or in the routing. The signals should approach the MUX area of the PCB in kind of a fan-in pattern, with the power and ground being routed from near the MUX area out to the sources of the signals. So for example, you would not put the power supply section in the upper left of the PCB, with the signal buffer circuits lined up along the left part of the PCB, since the bottom amp will share ground impedance with all of the amps above it and vise-versa. It's better to put the power supply circuit near the middle of the PCB, between the analog input and analog output areas.
Maybe post a floorplan of the PCB when you get farther along, and we can comment.