Oxidation in Processor Making: Purpose & Repeating?

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SUMMARY

Oxidation plays a crucial role in processor manufacturing by converting silicon into silicon oxide, which is essential for creating high-quality gate insulators in MOSFET transistors within CMOS technology. This thermal oxidation process occurs at very high temperatures, allowing for the formation of thin, smooth, and crystalline oxide layers, typically in the range of a few hundred nanometers. While thermal oxidation is ideal for early fabrication steps, it is not commonly used later due to potential issues like melting metal layers or unwanted crystallization. Alternative methods, such as chemical vapor deposition (CVD), are employed for other oxide applications in transistor insulation.

PREREQUISITES
  • Understanding of MOSFET transistor structure and function
  • Familiarity with CMOS technology
  • Knowledge of thermal oxidation processes in semiconductor manufacturing
  • Basic principles of chemical vapor deposition (CVD)
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  • Research the specifics of thermal oxidation in semiconductor fabrication
  • Explore the role of chemical vapor deposition (CVD) in oxide layer formation
  • Study the impact of high temperatures on semiconductor materials
  • Learn about the lithography techniques used in processor manufacturing
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This discussion is beneficial for semiconductor engineers, materials scientists, and anyone involved in the design and fabrication of integrated circuits, particularly those focusing on MOSFET and CMOS technologies.

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What is the purpose of oxidation during the process of making processor?

Is it repeatedly perform, like photography?
 
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You may wish to take a look at this slide (from the low-resolution 'How to Make a Transistor' presentation at Applied Materials):
http://www.appliedmaterials.com/htmat/static04.html

Oxidation converts the silicon into silicon oxide (a.k.a. oxide), at very high temperatures. As this is a slow process, it's used when you don't need a thick oxide (at most a few low hundreds of nm), but do need one which is high quality (smooth, crystalline, free of voids and pinholes). Creating the gate insulator of the MOSFET transistors that comprise CMOS is what this process is ideal for.

Since it happens at very high temperatures (which might melt metal layers, or migrating things you don't want migrated, or start crystallizing things you don't want crystallized), it isn't typically used beyond the early steps.

Thermal oxidation isn't the only way to make oxide however, so you'll usually see other oxide (like the plugs that insulate adjacent transistors from one another) deposited via some CVD (chemical vapour deposition) process.

Lastly, it's lithography, not photography. Hope this helps!
 
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