Discussion Overview
The discussion revolves around troubleshooting issues related to the thickness and hardening of SU-8 photoresist films in a microfabrication context. Participants are sharing their experiences and seeking advice on the baking process and exposure parameters to improve the quality of the photoresist films.
Discussion Character
- Exploratory, Technical explanation, Debate/contested
Main Points Raised
- One participant reports difficulties in achieving proper hardening of 100 micron thick SU-8 photoresist films before exposure, indicating a need for solutions.
- Another participant references the SU-8 datasheet, suggesting that the soft bake should not involve a convection oven and inquires about the specific baking conditions being used.
- The original poster describes their baking process, mentioning variations in temperature and time, and expresses uncertainty about whether the issue lies with the baking or the application of the photoresist.
- A participant points out discrepancies between the original poster's baking method and the datasheet recommendations, suggesting that the initial 65 degree step might be problematic and proposes adjustments to the baking time and temperature.
- Further inquiry is made into the exposure time and UV lamp intensity, with a suggestion that the pre-bake duration may be excessive compared to typical practices.
Areas of Agreement / Disagreement
Participants have not reached a consensus on the best approach to resolve the hardening issue, with multiple viewpoints on the baking process and exposure parameters being discussed.
Contextual Notes
There are limitations in the discussion regarding the specific conditions of the microfabrication setup, including the exact exposure parameters and the potential impact of varying baking methods on the photoresist performance.