SiC operation at high temperatures

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Discussion Overview

The discussion centers on the operational limits of Silicon Carbide (SiC) bipolar junction transistors (BJTs) and junction field-effect transistors (JFETs) at high temperatures, specifically exploring the factors that prevent these devices from functioning at temperatures around 1000°C. The conversation includes theoretical considerations, material properties, and practical implications for device design.

Discussion Character

  • Exploratory
  • Technical explanation
  • Debate/contested
  • Mathematical reasoning

Main Points Raised

  • Some participants note that SiC BJTs can operate at 500°C and SiC JFETs at 800°C, attributing this to their lack of a dielectric.
  • One participant questions the fundamental limitations preventing SiC devices from operating at 1000°C.
  • A participant references a publication discussing the intrinsic temperature of semiconductors, suggesting that while the intrinsic temperature is not a hard limit, the behavior of the transistor changes at high temperatures.
  • There are considerations about the mechanical design of components to withstand high temperatures, with some suggesting that this should not be the limiting factor with custom designs.
  • Another participant raises the idea of increasing doping to offset reaching the intrinsic temperature but questions the feasibility and implications of strong doping.
  • Concerns are expressed about the potential for increased leakage, higher junction temperatures, and reduced device reliability due to stronger doping concentrations.
  • Participants discuss the degradation of ohmic/Schottky contacts at high temperatures and seek further resources on this topic.
  • There is mention of reduced mobilities due to ionized impurity scattering at higher doping concentrations.
  • Questions are posed regarding the minimum mobility needed for digital computation and the appropriate ratio of doping concentration to intrinsic carrier concentration for integrated circuit applications.

Areas of Agreement / Disagreement

The discussion reflects multiple competing views and uncertainties regarding the operational limits of SiC devices at high temperatures, the effects of doping, and the implications for device reliability. No consensus has been reached on the best approach to address these challenges.

Contextual Notes

Participants highlight limitations related to doping effects, intrinsic carrier concentrations, and the mechanical design of devices, but these aspects remain unresolved and are subject to further exploration.

ZeroFunGame
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TL;DR
What is fundamentally preventing SiC BJTs and JFETs devices from operating at 1000C?
SiC BJT can operate at 500C and SiC JFET has shown to operate at 800C, due in part to their lack of a dielectric. What is fundamentally preventing SiC BJTs and JFETs devices from operating at 1000C?
 
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Links please. Thanks. :smile:
 
The same as for other semiconductors, and the publication you linked discusses this:
The advantage of a wide energy bandgap is that the intrinsic concentration is much lower, and therefore the intrinsic temperature is much higher. The intrinsic temperature can be calculated as the temperature at which the intrinsic concentration is equal to the lowest doping concentration in the semiconductor device
This temperature is not a hard upper limit but the behavior of the transistor will change in that range.

You also have to design all mechanical parts to withstand these temperatures, but with a custom design this shouldn't be what limits the temperature.
 
Thanks mfb! What is preventing the continual doping to increase the intrinsic temperature then? Seems like the hotter the environment, the higher the intrinsic concentration, then just increase the doping to offset reaching the intrinsic temperature?
 
Strong doping comes with its own disadvantages but I don't remember what exactly now.
 
I guess it would just become more and more conducting, which leads to further leakage and higher junction temperatures and power dissipation reducing device reliability. Just an initial guess.

Thinking about this some more, i suspect that the ohmic/shottky contacts between metal and SiC will degrade as well, but looking for further feedback from the community regarding good resources for this topic! Thanks!
 
ZeroFunGame said:
I guess it would just become more and more conducting, which leads to further leakage and higher junction temperatures and power dissipation reducing device reliability. Just an initial guess.

Thinking about this some more, i suspect that the ohmic/shottky contacts between metal and SiC will degrade as well, but looking for further feedback from the community regarding good resources for this topic! Thanks!
At higher doping concentrations you typically get reduced mobilities due to ionized impurity scattering.
 
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Vagn said:
At higher doping concentrations you typically get reduced mobilities due to ionized impurity scattering.

What's the minimum mobility needed for digital computation?
 
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Vagn said:
At higher doping concentrations you typically get reduced mobilities due to ionized impurity scattering.

Also, would there be an appropriate ratio of doping concentration vs intrinsic carrier concentration that would be appropriate for IC applications?
 

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