Solving Remote IC ESD Burning Problem

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Discussion Overview

The discussion revolves around a problem involving the destruction of an OpAmp (LM-324) in one electronics rack when sparks occur in a separate rack containing high voltage power supplies. Participants explore potential causes, including electromagnetic interference, ESD, and the specific characteristics of the OpAmp.

Discussion Character

  • Exploratory
  • Technical explanation
  • Debate/contested

Main Points Raised

  • One participant describes a situation where an OpAmp in a second rack is consistently destroyed when sparks occur in a first rack, which contains high voltage power supplies.
  • Another participant suggests using transorbs at the input of the OpAmps as a protective measure, citing their experience with CE certification requirements.
  • A different participant proposes that the issue may be related to RF susceptibility, questioning the level of EN 61000-4-3 testing the devices have undergone.
  • Another participant expresses skepticism about RF radiation being the cause, arguing that it requires more power and suggesting that the OpAmp's BJT input could be susceptible to other forms of damage, such as current surges from connector contact bounce.
  • One participant recounts a past experience where ICs were damaged due to momentary connector contact bounce, emphasizing that various factors could lead to IC failure.
  • There is a suggestion that the problem could be resolved easily by implementing protective measures like transorbs, based on past experiences with similar issues.

Areas of Agreement / Disagreement

Participants express differing views on the cause of the OpAmp failure, with some attributing it to RF susceptibility and others to power surges or contact bounce. No consensus is reached regarding the primary cause of the problem.

Contextual Notes

Participants note the specific characteristics of the LM-324 OpAmp and the conditions under which it fails, but there are unresolved questions about the exact mechanisms leading to its destruction.

Ravaner
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Hello. I encounter a strange problem I'll try to explain simply. I've design 2 electronics racks that have only in common the mains network and the ground. These 2 racks are separated by a distance of more than 2 feet. In one rack in which are installed several high voltage power supplies, some sparks can occur. Each time a spark occurs in this rack an OpAmp (LM-324) installed in 2nd rack is definitely destroyed. How can we explain that ? I insist on the fact that except ground (connected to earth) there is nothing common to the 2 racks and only this OpAmp is burned other IC's and transistors (placed on same board) are absolutely not affected.
 
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Unless I can see the system how they connect, really cannot trouble shoot like this. The best way is put transorbs at the input of those op-amps. For passing the CE cert, We were required to put transorbs on anything that went in and out of every single pcb.
 
Ravaner said:
Hello. I encounter a strange problem I'll try to explain simply. I've design 2 electronics racks that have only in common the mains network and the ground. These 2 racks are separated by a distance of more than 2 feet. In one rack in which are installed several high voltage power supplies, some sparks can occur. Each time a spark occurs in this rack an OpAmp (LM-324) installed in 2nd rack is definitely destroyed. How can we explain that ? I insist on the fact that except ground (connected to earth) there is nothing common to the 2 racks and only this OpAmp is burned other IC's and transistors (placed on same board) are absolutely not affected.

Sounds like an RF susceptibility problem in the 2nd rack. What level of EN 61000-4-3 Radiated RF Immunity testing did your devices pass?
 
I also suspect RF field (like in Hertz experience) but why always this OpAmp and not others which are very close and share same power supplies. Has LM-324 a specific sensibility for ESD ?
 
I don't believe it's RF radiation. Takes a lot more power to do it. It is power that burn the input. 324 is a BJT input, it is not the easiest to burn. It has been around for like 30 years and is being used all over.

There are lots of ways to burn an IC. You don't even need high voltage, we had problem burning ICs just by momentary connector contact bounce on a low voltage power pin. Particularly if you have coax cables. Coax is 30pF per foot. If you have 10' and charge at 5V. If you dump it to an input of an IC that is not powered up, that avalanche of current can pop an IC everytime in the right condition.

We had problem when we had the solder's weapon system that interface burn because of the connector contacts bounced when firing the M16 and we burn interface IC from just low voltage supply.

That is the reason I said it is so hard to nail down the cause. But the fix is so easy. Just put a Transorb for protection. We had so much argument at the time and they refused to put the transorb in until the other manager took a vacation and I put it in and solve the problem! Try that first and if that still don't work, then worry about it. You can spend days ( in our case, because it's military...months) trying to figure this out and it's so much easier to try the fix. It's power that burn, not likely HV as this is not CMOS and you said there is no HV even close to the connector.
 

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