I get the following question a lot: If I put a floating piece of sheetmetal near a PCB will it:
1 - increase radiated emissions because it will pick up noise and become an antenna?
2 - reduce radiated emissions because it will provide shielding or because "image currents" will be created that will cancel outgoing emissions?
In my experience neither of these wind up being good models for what is happening. Generally the sheetmetal simply introduces parasitic capacitances which, then, may effect emissions.
This distinctive sound (from Simon's "QB-EM shield" link) is what we call "TDMA buzz". The TDMA signal has a strong amplitude modulation at specific audio frequencies. Any non-linear device in the audio equipment will rectify (detect) the RF, then after the inherent low pass filtering we get this buzz. It is an issue for several reasons:
1 - Requires the audio equipment to be designed with 1.9GHz signals in mind. Cheap audio equipment may not have been constructed in a way to permit good filtering at 1.9GHz. There may not even be a ground plane in there. See
www.maxim-ic.com/an3880.
2 - CE mark requires audio equipment to have RF immunity to 3V/m 1.9GHz fields with 1KHz AM. But you have to be 2 or 3 meters away from a cellphone before field strength is down to 3V/m. iPhones are usually much closer than this to their speakers. Also, not all speakers are CE marked.
Back to the "shield". It is a misnomer to call this a shield. It is simply a piece of sheetmetal in close proximity to the iPhone chassis and its antenna. It introduces parasitic capacitance between the antenna and the chassis which loads the antenna and disturbs the antenna pattern. The noise is gone because we have weakened, and perhaps altered the directivity, of the interfering RF signal.