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When an IC photomask is being fabricated, a laser carefully dissolves specific portions of the photo resist to develop the precise pattern. But when we make ICs, we use a photomask to place over the silicon and shine coherent light over it at once.
Since most of the engineering problems arise from this photolithographic process using a photomask, why do we not just laser etch the silicon wafers themselves? Would it take too long?
Since most of the engineering problems arise from this photolithographic process using a photomask, why do we not just laser etch the silicon wafers themselves? Would it take too long?