Wirebonding - minimum contact area

[Hyo X]

I am designing a mask for a chip which might be used for wirebonding.
What is the minimum contact area for wirebonding using a microscope and microprobe?
Currently my contact pads are 220 x 220 um. Is that big enough?

 

[berkeman]

I am designing a mask for a chip which might be used for wirebonding.
What is the minimum contact area for wirebonding using a microscope and microprobe?
Currently my contact pads are 220 x 220 um. Is that big enough?

There should be design rules for this in your process design guidelines. What DFM (design for manufacturability) documents do you have access to for this process?

 

[meBigGuy]

The required bond pad size is dependent on the wire bonder and wire size. 220 x 220 is pretty large , but I have no idea what your bonder requires.

For example, the ball size (assuming ball bonding) may be 3 times the wire size and maybe you are using 1mil wire (25um) so the ball is 75um. You want the ball to be no more than 75% of the pad so that gives a min size of 100um. But the accuracy of the bonder (and possibly its operator) needs to be considered also.