- #1
dmo580
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I'm doing some growths on Cu/SiO2/Si stacks at temps around 800C. I'm getting adhesion issues clearly, and I know Cu definitely doesn't do that well.
What would be recommended? Should I put down a layer of Cr (or anything else?) first? And how thick of a layer? My SiO2 is about 1 micrion and Cu is about 300 nm thick.
Thanks!
What would be recommended? Should I put down a layer of Cr (or anything else?) first? And how thick of a layer? My SiO2 is about 1 micrion and Cu is about 300 nm thick.
Thanks!