Investigating the Impact of Chips on Packaging Pressure Differential

In summary, the debate surrounds whether or not having chips in the packaging will have an effect on the pressure differential during transport. One side argues that the smaller volume of air will result in less external pressure, while the other side believes it makes no difference as long as the pressure is applied externally. The experiment is to determine if adding chips will have an effect on the pressure differential.
  • #1
Danfishman
2
0
Hello,

I hope this is the right area to post this question. We are having a debate at my workplace and was hoping there was someone more qualified to settle the debate.

We are a packaging company and have setup an experiment to test the pressure differnential from sealiong at 1800m vs. Sea Level. We would like to see if the packaging can with stand the external pressure at sea level. We have calculated this diffence to roughly .2 bar (~3PSI), set up an experiment by placing the sealed packs in pressure chamber, and add the 3psi of air to the tank.

The debate came about as to wether adding chips (the product) would effect the result. Ie decreasing the amount of air (chips are displacing the air) would help offset the external air pressure being applied.

One side is saying that the smaller volume of air will result in less external pressure as there is less air trying to equalise. The otherside believes it makes no difference, as the pressure is being applied externally and the amount of air is inside makes no difference, as long it is at the same pressure in both instances.

Would having chips in the packaging affect the result?

Cheers!
 
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  • #2
Welcome, @Danfishman !

Could you describe the package?
 
  • #3
Sure,

It is a cardboard/ paperboard can, like a pringles can.
 
  • #4
Danfishman said:
One side is saying that the smaller volume of air will result in less external pressure as there is less air trying to equalise

That argument doesn't make sense.
The external pressure is established by the elevation.
 
  • #5
Danfishman said:
It is a cardboard/ paperboard can, like a pringles can.
If the lid is clipped on, the can will probably breathe out when taken to a higher altitude, where the external air pressure will be less. If taken to a lower altitude, the increased pressure may seal the lid and so provide a positive external pressure.

I expect the aim should be to avoid the inward flow of air that could introduce spores or contaminants to the product.

The details of the lid seal will be critical to determining the pressure differential during transport.
 
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  • #6
A breather, coupled to an internal balloon with a volume big enough to absorb the pressure differential will avoid stressing the package (that's one extreme). A rigid (like a submarine) package will maintain the internal pressure whatever your altitude. Which do you actually need?
My coffee packs have a breather valve which works one way, to let air out at altitude and the pack is always a bit wrinkled when the aircraft lands. This pack gives no physical protection to excess pressure (the coffee beans don't care) but avoids contaminated air entry.
 
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1. What is the purpose of investigating the impact of chips on packaging pressure differential?

The purpose of this investigation is to understand how chips (small, thin pieces of semiconductor material) affect the pressure differential within packaging materials. This is important because pressure differentials can impact the performance and reliability of electronic devices, and chips are often used in electronic packaging.

2. How will the investigation be conducted?

The investigation will involve conducting experiments in a controlled environment to measure the pressure differential in packaging materials with and without chips. The data collected will be analyzed and compared to determine the impact of chips on the pressure differential.

3. What factors will be considered in the investigation?

Several factors will be considered, such as the size and shape of the chips, the type of packaging material, and the temperature and humidity of the environment. These factors can all affect the pressure differential and will be controlled for in the experiments.

4. What potential applications can this investigation have?

The findings of this investigation can have applications in the electronics industry, where chips are commonly used in packaging. Understanding the impact of chips on pressure differentials can help improve the design and reliability of electronic devices, leading to better performance and longer lifetimes.

5. Are there any potential limitations or challenges in this investigation?

One potential limitation is that the experiments may not fully replicate real-world conditions, as the environment in a laboratory setting may differ from the conditions in which electronic devices are used. Additionally, there may be other factors that could impact the pressure differential in packaging materials that are not accounted for in the investigation.

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