Discussion Overview
The discussion centers on the selection of chip carriers and sockets suitable for use at low temperatures, specifically down to 4 K. Participants explore various options, materials, and configurations for effective thermal and electrical contact in cryogenic environments.
Discussion Character
- Exploratory
- Technical explanation
- Debate/contested
- Experimental/applied
Main Points Raised
- One participant seeks recommendations for chip carriers and sockets that function well at low temperatures, noting that many products are not rated below -70 C.
- Another participant suggests CMR's LCC carriers, highlighting their performance in high voltage and cryogenic conditions, while cautioning against their "mP-body" due to outgassing issues.
- A different viewpoint indicates that most LCC sockets are generally effective, and custom carriers made from standard FR4 laminate PCBs can be a cost-effective solution.
- Concerns are raised about the need for low outgassing materials and matching coefficients of thermal expansion (CTE) between carriers and sockets.
- One participant mentions that thermal expansion may not be a significant issue, but emphasizes the brittleness of plastics at low temperatures and suggests using solderable sockets for custom carriers.
- Alternatives for electrical connections to PCBs are discussed, including the use of twisted pairs, SMA connectors, and surface-mounted FPC sockets, with considerations for thermal conductivity.
- A participant outlines their chosen solution of ceramic LCC carriers and PLCC sockets, including plans for modifications to enhance thermal contact.
- Another participant inquires about the experiences of others regarding their test setups and outcomes.
Areas of Agreement / Disagreement
Participants express a range of opinions on the best materials and configurations for chip carriers and sockets at low temperatures. There is no consensus on a single solution, with multiple competing views and approaches presented throughout the discussion.
Contextual Notes
Participants note various limitations, including the potential for outgassing, the brittleness of plastics at low temperatures, and the importance of thermal contact. Specific requirements for experiments may dictate the choice of materials and configurations.