How can I design a rectangular piece of Silicon with n = 300cm^-3 at T = 300K?

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The discussion focuses on designing a rectangular piece of Silicon with an electron concentration (n) of 300 cm-3 at a temperature (T) of 300K. The intrinsic carrier concentration (ni) is calculated using the formula ni = 5.2 × 1015T3/2 e(−Eg/2kT), yielding ni = 1.0776 × 1010 electrons/cm3 with Eg = 1.12 eV and k = 1.38 × 10-23. The hole concentration (p) is determined to be 3.87 × 1017 cm-3 using the relationship n*p = ni2. The main inquiry shifts towards the doping process required to achieve these concentrations.

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Design a rectangular bpiece of Silicon with n = 300cm^-3 at T = 300K. Be specific and quantitative



n*p = ni^2
ni = 5.2 × 1015T3/2 e^(−Eg/2kT) electrons/cm^3




Using the formula above, with Eg = 1.12eV = 1.792x10^-19 J, and k = 1.38x10^-23
i get ni = 1.0776x10^10 electrons/cm^3
Using the formula n*p = ni^2, i solved for p = 3.87x10^17


As far as where to go next, I'm unsure. I sent a message to my prof. asking what exactly he wants for this question, but I haven't received a response yet. Would it be even feasible to attempt to get dimensions for a solid using just these values?
 
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Your p needs units.
I don't see how the size would be relevant here, unless there is something missing in the problem statement. You have to get a certain electron density, and this is independent of the size.
 
Last edited:
mfb said:
You p needs units.
I don't see how the size would be relevant here, unless there is something missing in the problem statement. You have to get a certain electron density, and this is independent of the size.

I got a message back from the prof. Turns out he was mostly just wanting to know what process would be used to actually make a piece of Si with n and p such as this. Essentially, he just wants to know what process of doping I would use. Oh well, I was pulling my hair out for nothing.
 

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