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I was wondering if there is a convention for solving heat conduction problems. Specifically should one account for thermal expansion? The SI units for thermal conductivity are W/m/K. Does m include thermal strains already?

It seems for basic problems it would be easier to adjust the thermal conductivity. (ie decrease the conductivity with temperature to account for the fact that the geometry would actually be larger due to thermal conductivity).

For more complicated problems where there are elastic and plastic strains where you explicitly define a deformed and undeformed frames it seems like you would want thermal conductivity in the deformed frame.

I've been working assuming it is in the deformed frame but a colegue has raised concerns. Is there a well known convention?

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# Influence of thermal expansion on thermal conductivity

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