Hello I am no expert so i apologize if the answer is trivial. I was wondering, if they can manufacture a transparent transistor on every (sub)pixel of LCD glass screen, why are they using "COF (Chip-On-Flex) or COG (Chip-On-Glass construction)" to connect every (sub)pixels' tiny wire at the end of row/column with LCD driver chip? Wouldn't it be much easyer to align neccesary tiny wires with connectors, if (non)transparent demulitplexer circuit was photolithographically "etched"(at the same time as pixel transistors are etched), so that connetcing wires leading to driver chip could be less tiny, less in number, and so easyer to connect (with less throwaway LCDs)? I am only talking about physical connection of (individual column/row) LCD glass wires -to- (silicon)chip wires, i know that further down only few signal wires are needed to drive LCD. Thanks for answers.