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farahtc
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A silicon wafer is 500 μm thick. The front surface is {100}. A mask consists of a rectangular window of unknown size. The sides of the window are parallel to <110>. After through-wafer etch, a window (50 μm by 80 μm) is formed on the other side of the wafer. Find the size of the original mask window assuming the etch rate of {111} surfaces is 1/100 that of {100} surfaces.
I need to solve this one. Can anyone suggest any book/website from where I can get some help regarding this one?
I need to solve this one. Can anyone suggest any book/website from where I can get some help regarding this one?