- #1
TeddyLu
- 8
- 0
I'm currently doing a heat sink calculation design and having a little confused moment with the area of the chip with a AuSn (Gold Tin Solder) pre-cut that's attached to the bottom of the chip.
I've tried looking around online for AuSn's thermal resistance value, but there is none besides a thermal conductivity. I know that the thermal resistance and thermal conductivity is related as one is based on the area and the other based on the thickness respectively.
My question is would it even be necessary to calculate the thermal resistance and put it into my heat sink calculations as the thickness of the material is so small that it's negligible (about 1mm thick) in the overall aspect of the heat sink design?
I've tried looking around online for AuSn's thermal resistance value, but there is none besides a thermal conductivity. I know that the thermal resistance and thermal conductivity is related as one is based on the area and the other based on the thickness respectively.
My question is would it even be necessary to calculate the thermal resistance and put it into my heat sink calculations as the thickness of the material is so small that it's negligible (about 1mm thick) in the overall aspect of the heat sink design?