Understanding transistor Ptot in data sheet

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Discussion Overview

The discussion revolves around the definition of total power dissipation (Ptot) for transistors as specified in data sheets, particularly focusing on the conditions "Tamb < 25C" and "Tc < 25C". Participants explore the implications of these conditions, the role of heat sinks, and the thermal characteristics of different transistor packages.

Discussion Character

  • Technical explanation
  • Debate/contested
  • Mathematical reasoning

Main Points Raised

  • Some participants clarify that Ta refers to ambient temperature and Tc refers to case temperature.
  • There is speculation that Tc might imply usage with a heat sink, though some argue that the TO92 case is not well suited for heat sinks.
  • Participants discuss the thermal resistance to case and ambient, noting that many transistors have their collector bonded to the metal case for effective heat transfer.
  • One participant questions whether the Ptot based on Tc assumes zero thermal resistance to 25C, suggesting this would be purely theoretical.
  • There is a discussion about the derating factors for power dissipation at temperatures above 25C and how these factors affect maximum power ratings.
  • Some participants express uncertainty about the practical implications of using heat sinks and the actual temperatures that can be achieved.
  • One participant mentions the potential for confusion between different transistor package versions and their respective thermal characteristics.

Areas of Agreement / Disagreement

Participants express a range of views on the definitions and implications of power dissipation in relation to temperature conditions. There is no consensus on the effectiveness of heat sinks for the TO92 package or the interpretation of derating factors, indicating ongoing debate and uncertainty.

Contextual Notes

Limitations include potential confusion between different transistor package specifications, assumptions about thermal resistance, and the practical effectiveness of heat sinks in maintaining specified temperatures.

SwedishWings
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Hi,

referring to the attached image, I wonder how total power dissipation is defined in each case; "Tamb < 25C" and "Tc < 25C" respectively. I suspect that Tc is referring to usage with a heat-sink , but it makes no sense as the TO92 case is not well suited for heat sinks.

Thanks in advance!
 

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SwedishWings said:
Hi,
referring to the attached image, I wonder how total power dissipation is defined in each case; "Tamb < 25C" and "Tc < 25C" respectively.
Ta = ambient temperature, Tc = case temperature.
I suspect that Tc is referring to usage with a heat-sink, but it makes no sense as the TO92 case is not well suited for heat sinks.
Really?
http://uk.rs-online.com/web/p/heatsinks/7124320/
http://www.rapidonline.com/electronic-components/to-92-heatsink-77178
Or make your own from a small metal plate held onto the transistor with heat-shrink tubing!

It's unlikely a heat sink would keep the case temperature down to 25C, but the data sheet should give the derating factors for higher temperatures, as in http://www.onsemi.com/pub_link/Collateral/P2N2222A-D.PDF
 
SwedishWings said:
Hi,

referring to the attached image, I wonder how total power dissipation is defined in each case; "Tamb < 25C" and "Tc < 25C" respectively. I suspect that Tc is referring to usage with a heat-sink , but it makes no sense as the TO92 case is not well suited for heat sinks.

Thanks in advance!

Were those numbers for the TO-92 package version, or maybe for a different package option (like metal can)?
 
There's a "Thermal resistance to case" and a different "Thermal resistance to ambient".
Many transistors have their collector bonded right to the metal case for good heat transfer.
As you observed - with a heatsink you'd add 'to case' thermal resistance to heatsink's thermal resistance to get thermal to ambient...

I like the metal can (TO39?) for troubleshooting.

352af251-a2f3-4c34-9e22-c214002207ae_zps6f54d984.png


The one on the left had its base wire melted off inside, emitter too if i recall. We attributed that one to human error not aging. Probably a 'scope ground probe got plugged into the wrong test point.
 
berkeman said:
Were those numbers for the TO-92 package version, or maybe for a different package option (like metal can)?

Yeah, i think i might have mixed up the data sheets, that would be the TO-18 case. But are there any heat-sinks for TO-18?
 
AlephZero said:
Ta = ambient temperature, Tc = case temperature.

Really?
http://uk.rs-online.com/web/p/heatsinks/7124320/
http://www.rapidonline.com/electronic-components/to-92-heatsink-77178
Or make your own from a small metal plate held onto the transistor with heat-shrink tubing!

It's unlikely a heat sink would keep the case temperature down to 25C, but the data sheet should give the derating factors for higher temperatures, as in http://www.onsemi.com/pub_link/Collateral/P2N2222A-D.PDF

I totally missed the fact that there are heat-sinks for those casings. Thanks!
 
jim hardy said:
There's a "Thermal resistance to case" and a different "Thermal resistance to ambient".
Many transistors have their collector bonded right to the metal case for good heat transfer.
As you observed - with a heatsink you'd add 'to case' thermal resistance to heatsink's thermal resistance to get thermal to ambient...

Thanks for clarifying, think i understand now. But does the Tc based Ptot refer to _zero_ thermal resistance to 25C? That would be purely theoretical, right?

jim hardy said:
I like the metal can (TO39?) for troubleshooting.

Great idea, never thought about it =)
 
AlephZero said:
It's unlikely a heat sink would keep the case temperature down to 25C, but the data sheet should give the derating factors for higher temperatures, as in http://www.onsemi.com/pub_link/Collateral/P2N2222A-D.PDF

What does "Derate above 25°C - 5.0 mW/°C" actually mean? Is it the SOA that falls with 5mW/C?
 
Last edited:
But does the Tc based Ptot refer to _zero_ thermal resistance to 25C? That would be purely theoretical, right?

Zero thermal resistance case to ambient, yes. If you could keep the case at 25 deg you could dissipate 3 watts.

Take a look at the thermal resistances given here for TO-39 case
http://www.st.com/web/en/resource/technical/document/datasheet/CD00003223.pdf

compare to the plastic case...


try the numbers and see if both conditions get you to max junction temperature at max power dissipation.
 
  • #10
I would take the Ta values as meaning the device was on a circuit board in air, without any heat sink.

If you have a heat sink, you should know the thermal resistance between the case temperature and the air. For example the RS link gives the thermal resistance as 60 degrees C per watt.

So if you were dissipating 0.5W with that heatsink and Ta = 25C, Tc would be 25 + 60 x 0.5 = 55C.

The derating parameter tells you how the power rating decreases as the case temperature rises. If the max power rating is 1.5W at Tc = 25C and the derating is 12mW/C, at Tc = 55C it would be 1.5 - 0.012*(55-25) = 1.14W.

If you increase the actual power dissipated, Tc will rise and the max power rating will fall. When the actual power = the max power, that is the operating limit for the transistor with that type of heatsink.
 

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