Adhesion mechanism between titanium and gold?

Click For Summary
SUMMARY

The adhesion mechanism between titanium and gold films at room temperature (273-300 K) involves metallic bonding and interdiffusion, with titanium serving as an effective adhesion promoter on oxidized silicon substrates. While significant intermetallic formation, such as TiAu2, typically occurs at elevated temperatures, some degree of alloying is present even at lower temperatures. Relevant studies, including Tisone and Drobak's work on diffusion in thin film couples and Martinez et al.'s research on titanium diffusion in gold, provide further insights into this phenomenon.

PREREQUISITES
  • Understanding of thin film deposition techniques, specifically sputtering.
  • Knowledge of metallic bonding principles in materials science.
  • Familiarity with intermetallic compounds and their formation.
  • Basic concepts of diffusion in solid-state materials.
NEXT STEPS
  • Research the effects of temperature on intermetallic formation in the Ti-Au system.
  • Explore the study "Diffusion in Thin Film Ti–Au, Ti–Pd, and Ti–Pt Couples" by Tisone and Drobak.
  • Investigate the mechanisms of metallic bonding in thin films.
  • Examine the implications of titanium diffusion in gold thin films as discussed by Martinez et al.
USEFUL FOR

Materials scientists, engineers involved in thin film technology, and researchers focusing on adhesion mechanisms in metal systems will benefit from this discussion.

sabine_
Messages
4
Reaction score
0
Hi all,

I sputtered titanium (10 nm) - gold (~ 100 nm) films at room temperature on
oxidized silicon substrates. The titanium acts as an adhesion promoter between the SiO2
and the gold film.
My Question:
What is the adhesion mechanism between the titanium and gold film at room temperature (273-300 K)?

Thanks.

Sabbi
 
Physics news on Phys.org
Metallic bonding.
 
I thought of interdiffusion and building up of an intermetallic transition Zone (TiAu2, TiAu,...).
But this happens properly only at higher temperatures ?
Could you give me a reference for metallic bonding as the adhesion mechanism in the Ti-Au-System ?

Thanks a lot.
Best regards
 
Some degree of alloying occurs at all temperatures. Try Google Scholar for relevant studies, e.g., Tisone and Drobak, "Diffusion in Thin Film Ti–Au, Ti–Pd, and Ti–Pt Couples" and Martinez et al., "Titanium diffusion in gold thin films".
 
Thank you very much!sabi
 

Similar threads

  • · Replies 1 ·
Replies
1
Views
2K
  • · Replies 1 ·
Replies
1
Views
2K
  • · Replies 1 ·
Replies
1
Views
5K
  • · Replies 3 ·
Replies
3
Views
12K
  • · Replies 29 ·
Replies
29
Views
4K
  • · Replies 1 ·
Replies
1
Views
3K
  • · Replies 5 ·
Replies
5
Views
3K
  • · Replies 4 ·
Replies
4
Views
2K
Replies
4
Views
10K
  • · Replies 3 ·
Replies
3
Views
10K