Can Lead be Bonded to Inconel? Steps and Flux Needed for Metallurgical Bonding

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Discussion Overview

The discussion centers on the feasibility and methods for bonding lead to Inconel, specifically exploring metallurgical bonding techniques. Participants discuss potential intermediate materials, fluxes, and application conditions relevant to this process.

Discussion Character

  • Exploratory
  • Technical explanation
  • Debate/contested
  • Experimental/applied

Main Points Raised

  • One participant inquires about the possibility of bonding lead to Inconel and suggests bonding a second metal to Inconel first, then attaching lead to that.
  • Another participant asks for clarification on whether the bonding involves lead or lead-tin solder.
  • A participant mentions that a common method for bonding Inconel is using a NiCr-based braze and questions which type of Inconel is being used.
  • Details are provided about the specific application, including the thickness of the Inconel plate and the intended use of lead as a wear surface, with a suggestion that Inconel 625 may be the grade in question.
  • Questions are raised about the operating temperature at the interface between lead and Inconel and the thickness of the lead liner.
  • One participant mentions that during operation, the temperature is about 400°F and that the lead can be applied in liquid form.
  • A suggestion is made regarding the potential use of a high-temperature epoxy as an alternative bonding method.
  • Another participant expresses a preference for pursuing metallurgical bonding despite the complexity involved.

Areas of Agreement / Disagreement

Participants express varying opinions on the methods and materials for bonding lead to Inconel, with no consensus on the best approach or the specifics of the bonding process.

Contextual Notes

Participants mention specific conditions such as the operating temperature and the thickness of the lead liner, but there are uncertainties regarding the exact specifications of the Inconel grade and the effectiveness of proposed bonding methods.

Who May Find This Useful

This discussion may be useful for engineers, materials scientists, and professionals involved in metallurgical bonding processes, particularly those working with lead and Inconel in industrial applications.

mpatterson557
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I need to bond lead to Inconel? Is this possible? One method I thought about trying is to bond a second metal to the Inconel then bond the Lead(pb) to that> But what would be the steps fluxs and the like?
 
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Specifically, is that lead or lead-tin solder you with to bond?
 
mpatterson557 said:
I need to bond lead to Inconel? Is this possible? One method I thought about trying is to bond a second metal to the Inconel then bond the Lead(pb) to that> But what would be the steps fluxes and the like?
What is one attempting to do. Normally for a good joint/bond, one brazes Inconel with a NiCr-based braze.

Which type of Inconel is one using?
 
The door is 1/2 thick Inconel plate, the final surface is to be Lead(pb) but the intermediate material is not speced. The normal process is to grind a clean surface on the ferrous metal then apply a lead bearing flux, usually a mixture that includes zinc and copper heat till glossy then wipe clean. Then apply lead directly onto the tinned surface. as to what grade of inconel I am clueless except that it was speced for heat and low concentration sulpheric acid and mercury and chlorine. Nasty mix huh. The lead will act as a replaceable wear surface.
I believe it is Inconel 625.
 
What is operating temperature of the interface between Pb and Inconel?

Is the Pb liner thin - e.g., on the order of mm's?
 
during application unknown, during operation about 400 F 3 to 5 mm we can apply in liquid form if need be.
 
http://www.masterbond.com/php_news_release.html?nrfile=su46ht-2

Would a high temp epoxy work for you? If this one is not suitable, perhaps they have another formulation that would work.
 
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I would really like to do the metallurgical route if at all possible. Even if several steps are involved.
 

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