Discussion Overview
The discussion revolves around the maximum power handling capabilities of FC/APC fiber optic connectors, particularly in the context of issues related to connector damage and performance in high-power applications. Participants explore the implications of power levels on connector integrity and share personal experiences with connector failures.
Discussion Character
- Exploratory
- Technical explanation
- Debate/contested
Main Points Raised
- One participant inquires about the maximum peak and average power ratings for FC/APC connectors, noting issues with burning connector cores at 600mW average and 1KW peak power.
- Another participant provides information on potential damage mechanisms for fiber optic connectors, including the effects of high optical power densities and the risks associated with cleaning procedures while the connector is live.
- A participant expresses skepticism about the high power being the cause of connector damage, citing that the burnt connectors are not directly from the amplifier and that another pair before it does not burn.
- One participant identifies that not all FC/APC connectors have the same tip dimensions, suggesting that misalignment could lead to increased losses and subsequent burning of connectors.
- There is a discussion about the possibility of changing connector types or aligning them, with one participant indicating that they resolved the issue by splicing on a new connector with similar dimensions.
- Another participant expresses curiosity about alignment methods, indicating a lack of expertise in the area and seeking clarification on the solutions implemented.
Areas of Agreement / Disagreement
Participants do not reach a consensus on the cause of the connector damage, with differing views on the impact of power levels and connector dimensions. The discussion remains unresolved regarding the best practices for handling and maintaining fiber optic connectors under high power conditions.
Contextual Notes
Participants mention various factors that could contribute to connector damage, including power levels, connector design variations, and cleaning procedures, but do not fully explore the implications of these factors in a systematic way.