P & S Waves to Strains-liquid solid interface

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SUMMARY

The discussion centers on the separation of P and S waves at a liquid-solid interface, specifically referencing the article "P and S wave separation at a liquid-solid interface" from the CREWES research reports. Participants express interest in understanding the strain field characteristics near this interface under specific conditions, including a quiescent liquid above a solid, thermal conduction through the fluid, and 1D thermal conduction. The conversation highlights the importance of these factors in seismic studies and material science.

PREREQUISITES
  • Understanding of seismic wave propagation, specifically P and S waves
  • Knowledge of thermal conduction principles in fluids and solids
  • Familiarity with strain field analysis in material interfaces
  • Basic concepts of Earth Sciences and geophysics
NEXT STEPS
  • Research "P and S wave separation techniques in geophysics"
  • Study "Thermal conduction in fluids and its effects on solid interfaces"
  • Explore "Strain field analysis methods in material science"
  • Investigate "1D thermal conduction models and applications"
USEFUL FOR

Geophysicists, materials scientists, and researchers interested in seismic wave behavior and thermal interactions at liquid-solid interfaces.

MD LAT 1492
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Welcoming any relevant literature!
 
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Welcome to PF.
Since this is the Earth Sciences thread, the obtuse title probably refers to some seismic issue. I'm not going to guess any more.
 
Astronuc said:
What has one tried to find? The title seems to be copied of a title of an article.

P and S wave separation at a liquid-solid interface
https://www.crewes.org/Documents/ResearchReports/1995/1995-12.pdf
Thanks I hadn't seen that article before, but I will read it! Looking to understand the qualities of the strain field near the solid-liquid interface given:

1) quiescent liquid sitting above the solid below
2) thermal conduction that begins through the fluid conducting to the interface with the solid below
3) same species/material
4) 1D thermal conduction
 

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