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Q: wireless IC components

  1. Oct 10, 2013 #1

    Andy Resnick

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    Careful decapsulation of wireless chipsets results in these structures:

    http://imageshack.us/a/img690/7145/9yd4.jpg [Broken]

    http://imageshack.us/a/img854/7783/kq3i.jpg [Broken]

    http://imageshack.us/a/img850/3041/xxki.jpg [Broken]

    http://imageshack.us/a/img826/2589/easq.jpg [Broken]

    I'm hoping someone can provide clues/insight as to what these are. The substrate material is likely glass (SiO2), about as thick as a MEMS cantilever, and are generally not top layers of a 'standard' Silicon IC- they are stand-alone planar structures connected to a ground plane (not shown).

    Thanks in advance....
     
    Last edited by a moderator: May 6, 2017
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  3. Oct 10, 2013 #2

    f95toli

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    Difficult to tell.
    The structure on the 3rd picture is a (or perhaps more than one ) interdigital capacitor. At the bottom of the 4th image I can also see a spiral inductor.
     
  4. Oct 10, 2013 #3

    Andy Resnick

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    Right- I can recognize certain circuit elements from similar features on silicon RF ICs. On those silicon ICs tho, the coils etc. are just the top layer. These aren't capacitatively (is that a word?) coupled to anything- it's truly a planar circuit.

    Never mind the manufacturing magic needed to fabricate a zillion of these every second...
     
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