What are these mysterious structures on wireless chipsets?

In summary, careful decapsulation of wireless chipsets reveals planar structures made of glass or SiO2, with features such as interdigital capacitors and spiral inductors. These structures are not typically found on standard Silicon ICs and are likely stand-alone components connected to a ground plane. The manufacturing process for these structures is complex and requires advanced techniques.
  • #1
Andy Resnick
Science Advisor
Education Advisor
Insights Author
7,417
3,109
Careful decapsulation of wireless chipsets results in these structures:

http://imageshack.us/a/img690/7145/9yd4.jpg

http://imageshack.us/a/img854/7783/kq3i.jpg

http://imageshack.us/a/img850/3041/xxki.jpg

http://imageshack.us/a/img826/2589/easq.jpg

I'm hoping someone can provide clues/insight as to what these are. The substrate material is likely glass (SiO2), about as thick as a MEMS cantilever, and are generally not top layers of a 'standard' Silicon IC- they are stand-alone planar structures connected to a ground plane (not shown).

Thanks in advance...
 
Last edited by a moderator:
Engineering news on Phys.org
  • #2
Difficult to tell.
The structure on the 3rd picture is a (or perhaps more than one ) interdigital capacitor. At the bottom of the 4th image I can also see a spiral inductor.
 
  • #3
Right- I can recognize certain circuit elements from similar features on silicon RF ICs. On those silicon ICs tho, the coils etc. are just the top layer. These aren't capacitatively (is that a word?) coupled to anything- it's truly a planar circuit.

Never mind the manufacturing magic needed to fabricate a zillion of these every second...
 

1. What are wireless IC components?

Wireless IC (Integrated Circuit) components are small electronic devices that are used to transmit and receive wireless signals. These components are commonly found in communication devices such as smartphones, laptops, and routers.

2. How do wireless IC components work?

Wireless IC components use a combination of radio frequency (RF) and digital circuits to transmit and receive wireless signals. They convert electrical signals into radio waves and vice versa, allowing for wireless communication.

3. What types of wireless IC components are there?

There are various types of wireless IC components, including amplifiers, filters, mixers, and oscillators. Each type serves a specific function in the wireless communication process.

4. What are the advantages of using wireless IC components?

Wireless IC components offer several advantages, including improved signal quality, reduced power consumption, and smaller size. They also allow for easier integration into devices and can support multiple wireless standards.

5. How are wireless IC components tested for quality?

Wireless IC components undergo rigorous testing for quality assurance. This includes tests for functionality, performance, and reliability. They are also tested for compatibility with different wireless networks and devices.

Hot Threads

Recent Insights

Back
Top