Q: wireless IC components

  • #1
Andy Resnick
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Main Question or Discussion Point

Careful decapsulation of wireless chipsets results in these structures:

http://imageshack.us/a/img690/7145/9yd4.jpg [Broken]

http://imageshack.us/a/img854/7783/kq3i.jpg [Broken]

http://imageshack.us/a/img850/3041/xxki.jpg [Broken]

http://imageshack.us/a/img826/2589/easq.jpg [Broken]

I'm hoping someone can provide clues/insight as to what these are. The substrate material is likely glass (SiO2), about as thick as a MEMS cantilever, and are generally not top layers of a 'standard' Silicon IC- they are stand-alone planar structures connected to a ground plane (not shown).

Thanks in advance....
 
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Answers and Replies

  • #2
f95toli
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Difficult to tell.
The structure on the 3rd picture is a (or perhaps more than one ) interdigital capacitor. At the bottom of the 4th image I can also see a spiral inductor.
 
  • #3
Andy Resnick
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Right- I can recognize certain circuit elements from similar features on silicon RF ICs. On those silicon ICs tho, the coils etc. are just the top layer. These aren't capacitatively (is that a word?) coupled to anything- it's truly a planar circuit.

Never mind the manufacturing magic needed to fabricate a zillion of these every second...
 

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