Question on MOS strong inversion

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In summary, the maximum depletion width (xdmax) for a uniformly doped semiconductor is given by the relation: X_{dmax}=\sqrt{\frac{K_s\epsilon_0 k_B T}{q^2N_A} log(\frac{N_A}{n_i})}
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Hi, I am a bit confused about the MOS strong inversion case.
When Vg>>Vth, is the equation describing gate voltage at threshold still applicable? If not, what is the expression for corresponding surface potential and depletion width. Some books suggest that surface potential and depletion width won't change much, please explain why. If it's not easy to explain by posting, could anyone please send me a link or reference? Thank you!
 
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  • #2
As you increase the charge on the gate, this charge needs to be compensated by charge in the semiconductor. At first, the charge is compensated by an increasing depletion region, which "uncovers" fixed charge in the semiconductor. However, as the gate voltage increases, you reach a point where it is energetically more favorable for charge on the gate to be compensated by inversion charge at the surface instead of further depletion. This is the threshold voltage. At this point the depletion region stops growing (this depletion region width is usually called xdmax), and the inversion charge starts increasing. The surface potential doesn't change much beyond this because the inversion charge is an exponential function of the surface potential, so it only takes a small change in the surface potential to get a large change in the inversion charge.

The maximum depletion width (xdmax) for a uniformly doped semiconductor is given by the relation:
[tex]X_{dmax}=\sqrt{\frac{K_s\epsilon_0 k_B T}{q^2N_A} log(\frac{N_A}{n_i})}[/tex]
 
  • #3
Thank you phyzguy!

So it means as the gate voltage increases, the voltage across the oxide will increase while the surface potential is constant?

And the assumption that semiconductor bulk charge is much greater than inversion charge (Qb >> Qinv) which was used in deriving the threshold voltage is no longer valid after inversion?

And is there a way to quantify the inversion charge besides using Qg - Qb = Qinv in strong inversion?
 

1. What is MOS strong inversion?

MOS strong inversion is a state in which a MOS (metal-oxide-semiconductor) transistor is biased such that there is a high concentration of majority carriers (electrons or holes) in the inversion layer between the metal gate and the semiconductor channel. This state allows the transistor to function as an amplifier or switch.

2. How is MOS strong inversion achieved?

MOS strong inversion is achieved by applying a positive voltage to the gate of a MOS transistor, which creates a depletion region that attracts majority carriers and forms an inversion layer in the semiconductor channel. This voltage must be higher than the threshold voltage of the transistor, which varies depending on the transistor's characteristics.

3. What are the effects of MOS strong inversion on transistor performance?

MOS strong inversion allows for the efficient operation of a MOS transistor as an amplifier or switch. It also results in a high drain current and low output resistance, leading to a high voltage gain and better signal integrity. However, it can also cause issues such as channel hot-carrier effects and gate oxide breakdown if not properly controlled.

4. How is MOS strong inversion different from weak inversion?

MOS strong inversion and weak inversion refer to different biasing states of a MOS transistor. In strong inversion, the gate voltage is high enough to form a highly conductive inversion layer, while in weak inversion, the gate voltage is lower and the inversion layer is less conductive. Weak inversion is used for low-power applications, while strong inversion is used for high-performance applications.

5. What factors affect the strength of MOS strong inversion?

The strength of MOS strong inversion is primarily determined by the gate voltage and the transistor's threshold voltage. Other factors that can affect it include the doping concentration in the semiconductor channel, the type of semiconductor material used, and the temperature of the device.

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