Reducing Gap Around IC Chip Pins for 0.5mm Track

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hayowazzup
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Hello, I am currently working on a PCB design project,
just wondering if anybody knows how to reduce the size of the gap(the black circular region) around individual pin of IC Chips (after I have done the polygon pour)
so that a 0.5mm ground track can get through.
In addition, what is the minimum size that I could reduce it down to? does that depend on the "pcb board printer"?

unfortunately I cannot upload the image for now
but here is an example involving ic chips


n:ANd9GcR_AEJb_ArrA6r_m6jOq4IgU5AQ5Aalsev5zxSpEPIj3e27HSU&t=1&usg=__bs0xY1-ni17-1ETuSybQbb_aep0=.jpg
 
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You will have to adjust your clearance rules to change this. You would enter a new rule for this specific section using the query builder and make sure to set it to a higher priority than the other clearance rules. Generally speaking, I would recommend 15-20 mils of clearance between the pads and the ground pour with TH board assemblies. This reduces the risk of shorts during manufacturing.

To answer your other question, yes, minimum clearance and trace width are functions of the board house. 10mil clearance and track width should be pretty common place, but you should always check first.
 
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