Samarth-R
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- TL;DR Summary
- I have designed a Power Distribution Board (PDB) intended to handle 50V and 1000A. The design consists of two 4mm thick, 99% pure copper plates, separated by three insulating layers (top, bottom, and middle). The top plate is VCC (+), and the bottom plate is ground (-). Components like ESE and motors will be soldered directly onto the plates.
My main concern is whether this setup is safe for handling the specified voltage and current
I have a Board design of PDB in which in theory should handle 50 V and 1000 amps of current. The Board consist of two copper plates sandwiched between 3 insulating plates , one on top ,one on bottom and one between copper plates, the copper is 99% pure and the thickness of each copper plate is 4mm. The top copper plate will be connected to VCC/+ve and bottom plate will be ground/-ve . The components (ESE and motors) will directly be soldered onto the plate. Is this process safe with amount of voltage and Current it is handling