A Tin Whisker (TW) growth in Electronics

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Summary
I am preparing a presentation on TW and have reviewed the NASA site which is good, but most of the data is at least 10 years old.
I am preparing a presentation on TW and have reviewed the NASA site which is good, but most of the data is at least 10 years old. Does anyone have any current data on TW mitigation?
Here is the NASA link I used ►► https://nepp.nasa.gov/whisker/
Thanks, Ray
 
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Summary: I am preparing a presentation on TW and have reviewed the NASA site which is good, but most of the data is at least 10 years old.

I am preparing a presentation on TW and have reviewed the NASA site which is good, but most of the data is at least 10 years old. Does anyone have any current data on TW mitigation?
Here is the NASA link I used ►► https://nepp.nasa.gov/whisker/
Thanks, Ray
A.f.a.i.k., additional metals in Sn96Ag3Cu0.7 (my third preferred solder after Sn-Pb and Sn-Bi) or similar alloys are suppressing tin whiskers good enough. I have evaluated many parts soldered with it after 10-15 years of service and never seen a whisker in soldered joints. Cheap connectors which are sometimes plated with pure tin are a problem though - learned to avoid them.
 
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