Ways to minimize scattering as T increases

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SUMMARY

This discussion focuses on minimizing Coulomb and phonon scattering in MOSFETs as temperature increases, particularly in the context of ring oscillators and circuit performance. Key strategies include improving surface state density through enhanced dielectrics, employing isotropic doping to achieve uniform doping profiles, and utilizing strain engineering to reduce phonon scattering. Alternative semiconductor materials like Gallium Nitride (GaN), Diamond, and Silicon Carbide (SiC) are also considered for their superior thermal and electrical properties compared to Silicon. The overarching goal is to maintain frequency stability in circuits without resorting to cooling methods.

PREREQUISITES
  • MOSFET operation principles
  • Understanding of Coulomb and phonon scattering mechanisms
  • Knowledge of semiconductor material properties
  • Familiarity with circuit design and performance metrics
NEXT STEPS
  • Research "semiconductor material engineering techniques" for improved device performance
  • Explore "isotropic doping methods" and their impact on mobility
  • Investigate "strain engineering" in semiconductor devices
  • Study the properties and applications of "Gallium Nitride (GaN) and Silicon Carbide (SiC)" in high-temperature environments
USEFUL FOR

This discussion is beneficial for semiconductor engineers, circuit designers, and researchers focused on enhancing MOSFET performance and understanding the effects of temperature on electronic devices.

ZeroFunGame
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as temperature rises in a MOSFET, are there tricks to prevent the Coulomb/phonon scattering? Or at least minimize it?
as temperature rises in a MOSFET, are there tricks to prevent the Coulomb/phonon scattering? Or at least minimize it?

This is in reference to Fig 4 here:
https://pdfs.semanticscholar.org/f8a0/b9b7030f7201ef17c6ff66ec660fd75c7aae.pdf

The more overarching question is related to ring oscillators and circuits in general, and whether there is a way to minimize frequency degradation as temperature is increased.
 
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Dip the circuit in liquid nitrogen.
 
Added the caveat that you cannot cool the device :)

I was thinking semiconductor material engineering, or circuit compensation, etc. Not sure if these actually exist as solutions
 
ZeroFunGame said:
Added the caveat that you cannot cool the device :)

I was thinking semiconductor material engineering, or circuit compensation, etc. Not sure if these actually exist as solutions

Improve surface state density via improved dielectrics, reduce phonon scattering via strain and isotropic doping, reduce surface scattering by reducing surface roughness. There's a few more, but I guess standard channel engineering tricks to boost mobility is the way to go
 
ZeroFunGame said:
Improve surface state density via improved dielectrics
Could you explain what you mean by this quote above?

What is isotropic doping?

Could you also talk about your limitations? For example, must you use silicon?
 
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Dr_Nate said:
Could you explain what you mean by this quote above?

What is isotropic doping?

Could you also talk about your limitations? For example, must you use silicon?

My understanding is that you want to reduce interface states and charge traps, as this could lead to greater scattering at the dielectric semiconductor interface, thus reducing mobility (please correct me if I am mistaken)

Isotropic doping, I assume means uniform doping as a function of depth, but my understanding here could be mistaken.

Limitations? No, you don't have you use silicon. For example, why not use GaN since they have a wide bandgap. But then the limitations wouldn't be interface states or doping since it's a HEMT structure. Diamond or GaO or SiC could be another option. I'm not sure what you mean by limitations -- for Si, it's the dominance of intrinsic carriers as T increases
 
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