Barium cannot be electroplated onto copper primarily due to its high reactivity and the instability of barium ions in aqueous solutions, which leads to the formation of barium hydroxide rather than a stable plating. Additionally, the electrochemical potential of barium is more negative than that of copper, making it thermodynamically unfavorable to deposit barium onto copper through electroplating. The discussion emphasizes that attempts to solve the question must be presented to receive assistance, adhering to forum policies. Overall, the challenges of electroplating barium stem from its chemical properties and the conditions required for successful deposition. Understanding these factors is crucial for addressing the exam question effectively.
