With semiconductors, as temp increases, more electron-hole pairs, ehp, are generated due to increased thermal energy. Hence more electrons/holes are available for conduction. Hence for a given E field, more charges are out into motion at higher temp due to greater abundance of carriers. So semiconductor resistivity decreases as temp increases.
A FET, however does not rely on thermally generated ehp for available charge carriers. A FET relies on inversion. An n-channel FET is actually a p-channel substrate w/ n-channel drain & source. When the gate-source terminals are biased w/ an external source, charge polarization occurs. The p-channel substrate is literally flooded w/ n-type carriers, namely electrons. Hence electrons are the majority carriers & have high mobility, & move easily w/ an E field.
When temp increases, more collisions take place between electrons & lattice structure, inelastic in nature. This is resistance which increases w/ temp. This occurs in other semiconductors, but this property is small compared w/ the large non-linear increases in carriers due to ehp thermal generation.
Also, as temp increases, the substrate, naturally being p-type, generates more ehp, resulting in additional hole mobility which recombine w/ electrons. But electrons are the majority, so extra holes neutralize the effective number of charge carriers & resistance goes up due to net conduction electrons decreasing.
Normally, semiconductor conductivity is due to thermally generated ehp. But FETs use inversion by transporting electrons into the p substrate, overnumbering the holes, making electrons the new majority charge carrier. Hence the temp characteristic is markedly different.
Claude