Backgating (chip) advantages.

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Discussion Overview

The discussion centers on the concept of backgating in conducting polymers on chips, exploring its advantages and disadvantages compared to electrochemical gating. Participants also inquire about the implications of these methods on charge distribution and electric field uniformity.

Discussion Character

  • Technical explanation
  • Debate/contested

Main Points Raised

  • Some participants describe backgating as applying an electric field from beneath the substrate, while electrochemical gating involves altering the local electronic environment in solution.
  • There is a question regarding the uniformity of the electric field applied by a backgate across the channel.
  • Concerns are raised about the potential negative effects of ionic liquids on the channel in backgating scenarios.
  • One participant mentions the thickness of integrated circuits and the challenges of controlling surface structures with backside contacts, suggesting that thinning the wafer may be necessary for effective control.

Areas of Agreement / Disagreement

Participants express differing views on the effectiveness and practicality of backgating versus electrochemical gating, indicating that the discussion remains unresolved with multiple competing perspectives.

Contextual Notes

Limitations include the dependence on specific definitions of "gating" and the challenges associated with wafer thickness in practical applications.

Hyo X
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Several ways to gate a conducting polymer on a chip.
Backgating, electrochemical gating.
What is backgating and what advantages/disadvantages would it have?
How does electrochemical gating work?
specifically regarding homogenous charge distribution or uniform electric field applied.
 
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Hyo X said:
Several ways to gate a conducting polymer on a chip.
Backgating, electrochemical gating.
What is backgating and what advantages/disadvantages would it have?
How does electrochemical gating work?
specifically regarding homogenous charge distribution or uniform electric field applied.

By "gating", do you maybe mean "coating" or "plating"? Where have you seen the term "gating"?
 
Gating as in for a transistor.
A three point probe with a source, drain, and a gate to apply a potential across the channel.

In this case, I was saying, using a conducting polymer (or polymer film) as the channel between source and drain.
Backgating would be applying the electric field from under the substrate (i.e. the back)
electrochemical gating involves changing the gate potential on the channel by altering its local electronic environment in solution.

What are the advantages and disadvantages of each?
Can you expect the electric field applied by a backgate to be uniform across the channel?
Would ionic liquid have negative effects on the channel?
thanks
 
Typically integrated circuits are 350 to 500 microns thick so it is difficult to control a surface structure using a backside contact. Typically if the backside of the wafer is contacted at all, it is grounded with a conductive epoxy.

If you want to control the surface potential of the semiconductor in any substantive way, you will have to thin the wafer, which is both challenging and expensive, but is done in practice in some cases.
 

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