Wire bonding low ductility materials like Chromel, Manganin, and Konstantan poses significant challenges due to their bonding properties. Successful bonding often requires careful consideration of pad temperature, pressure, and power, with gold pads being preferred for their compatibility. The bonding process is complicated by the need for specific combinations of materials and the correct type of bonding wedge, as certain materials cannot bond effectively to others. Alternative methods, such as using silver paste or carbon probes, have been suggested for bonding high nickel wires, but these can be messy or require specialized equipment. Overall, achieving reliable bonds with low ductility materials demands precise control and understanding of the bonding environment.