Diffraction and Semi-Conductor Lithography

In summary, semiconductor manufacturing has found ways to overcome the limitations of diffraction in light-based etching, allowing for processors with transistors on a scale of tens of nanometers to be possible. This has been a topic of discussion for years, and while there are some limiting factors, specialized techniques such as sub-wavelength and sub-diffraction limit techniques have been developed, as seen in the 65 nm process technology. However, further in-depth explanations are available in resources such as the Wikipedia article mentioned.
  • #1
peter.ell
43
0
I was curious as to how semiconductor manufacturing gets around the fact that diffraction should prevent processors with transistors on the scale of tens of nanometers from being possible.

How do we get around this if the diffraction of light is a fundamental limit to how small we can do any light-based etching?

Thanks so much!
 
Engineering news on Phys.org
  • #2
It gets tougher and tougher, but the impending end of photolithography has been predicted for years on end. I'm not an expert in photolithography (especially at the low-end of size scales), but yes, there are some limiting factors:
http://en.wikipedia.org/wiki/Photolithography#Resolution_in_projection_systems

The more specialized sub-wavelength and sub-diffraction limit techniques are discussed in more detail at the Wikipedia article starting with the 65 nm process technology:
http://en.wikipedia.org/wiki/65_nanometer

Not an in-depth explanation, but hopefully a starting point.
 

1. What is diffraction and how does it relate to semi-conductor lithography?

Diffraction is the bending or spreading of waves as they pass through an opening or around an obstacle. In semi-conductor lithography, diffraction is used to create the patterns necessary for printing circuits on a chip.

2. What is the difference between diffraction and refraction?

Diffraction and refraction are both related to the bending of waves, but they differ in the mechanism by which this bending occurs. Diffraction occurs when waves pass through an opening or around an obstacle, while refraction occurs when waves pass through different mediums with varying densities.

3. How is diffraction used in semi-conductor lithography?

In semi-conductor lithography, diffraction is used to create patterns on a photoresist layer. The photoresist is exposed to a light source through a mask containing the desired pattern. The diffraction of light through the mask creates the desired pattern on the photoresist, which is then developed and used as a template for the circuit patterns on the chip.

4. What are the limitations of diffraction in semi-conductor lithography?

One limitation of diffraction in semi-conductor lithography is the diffraction limit, which is the minimum feature size that can be achieved. As the wavelength of light used in lithography decreases, the diffraction limit also decreases, making it more challenging to print smaller patterns. Another limitation is the interference caused by multiple diffraction patterns, which can result in unwanted patterns on the chip.

5. How does the use of extreme ultraviolet (EUV) light impact semi-conductor lithography and diffraction?

EUV light has a much shorter wavelength than traditional lithography light sources, which allows for smaller diffraction limits and the printing of smaller features on the chip. However, EUV light is challenging to produce and work with, making it a more expensive and complex lithography method compared to traditional methods.

Similar threads

  • Astronomy and Astrophysics
Replies
1
Views
683
Replies
7
Views
1K
  • Electrical Engineering
Replies
10
Views
2K
Replies
7
Views
5K
Replies
7
Views
1K
Replies
152
Views
4K
Replies
2
Views
1K
Replies
8
Views
916
Replies
8
Views
2K
Back
Top