Oxidation in Processor Making: Purpose & Repeating?

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Oxidation in processor manufacturing serves to convert silicon into high-quality silicon oxide, crucial for creating gate insulators in MOSFET transistors used in CMOS technology. This process occurs at high temperatures and is slow, making it suitable for producing thin, smooth oxide layers without defects. While thermal oxidation is effective for early steps, it is limited due to potential damage to metal layers and unwanted crystallization. Other methods, such as chemical vapor deposition (CVD), are employed for additional oxide layers, particularly for insulating adjacent transistors. Understanding these processes is essential for optimizing semiconductor fabrication.
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What is the purpose of oxidation during the process of making processor?

Is it repeatedly perform, like photography?
 
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You may wish to take a look at this slide (from the low-resolution 'How to Make a Transistor' presentation at Applied Materials):
http://www.appliedmaterials.com/htmat/static04.html

Oxidation converts the silicon into silicon oxide (a.k.a. oxide), at very high temperatures. As this is a slow process, it's used when you don't need a thick oxide (at most a few low hundreds of nm), but do need one which is high quality (smooth, crystalline, free of voids and pinholes). Creating the gate insulator of the MOSFET transistors that comprise CMOS is what this process is ideal for.

Since it happens at very high temperatures (which might melt metal layers, or migrating things you don't want migrated, or start crystallizing things you don't want crystallized), it isn't typically used beyond the early steps.

Thermal oxidation isn't the only way to make oxide however, so you'll usually see other oxide (like the plugs that insulate adjacent transistors from one another) deposited via some CVD (chemical vapour deposition) process.

Lastly, it's lithography, not photography. Hope this helps!
 
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