A process corner is a model representing the extremes of variability in semiconductor manufacturing, not a physical corner on a silicon wafer. It captures the statistical distribution of process variables like oxide thickness and doping concentration, which affect chip speed. Variations from the mean speed are categorized into different corners, such as fast-fast (FF) and slow-slow (SS), with temperature influencing performance; for instance, hotter conditions typically slow down digital logic. Different circuits respond variably to these corners, necessitating testing across all process and temperature scenarios to identify the slowest conditions. Understanding process corners is crucial for maintaining production quality and managing design sensitivities.