Steady state temperature of wafers?

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Discussion Overview

The discussion revolves around determining the steady state temperature of a 50mm wafer implanted with Boron, considering conductive cooling. Participants explore the calculations necessary to find the steady state temperature and the time constant for heating, while addressing the implications of the given parameters.

Discussion Character

  • Homework-related
  • Mathematical reasoning
  • Technical explanation

Main Points Raised

  • Participants discuss the thermal resistance and its role in calculating the steady state temperature of the wafer.
  • There is a focus on calculating the energy carried by Boron atoms based on the given implant current and energy per atom.
  • Some participants express uncertainty about how to calculate the number of Boron atoms impinging on the wafer per second and seek guidance on the necessary equations.
  • One participant mentions a formula for temperature change over time, indicating a need to identify the steady state temperature and time constant.
  • Another participant suggests using the implant current to determine the number of Boron ions deposited per second.
  • References to external resources, such as Wikipedia articles on thermal resistance and heat transfer, are provided to assist with understanding the concepts involved.

Areas of Agreement / Disagreement

Participants generally agree on the need to calculate the steady state temperature and time constant, but there is no consensus on the specific methods or equations to use. Uncertainty remains regarding the calculation of the number of Boron atoms and the implications of the given parameters.

Contextual Notes

Participants have not fully resolved the assumptions regarding the number of Boron atoms impinging on the wafer or the specific equations needed for calculations. There are also unresolved mathematical steps related to the thermal resistance and energy calculations.

Obelisk
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Homework Statement



A 50mm wafer, 2mm thick is implanted with Boron at 100keV and 1mA. Considering only conductive cooling, given that thermal resistance is 10K/W, to room temperature of 25oC, determine the steady state wafer temperature and also the time constant for heating

Homework Equations



I know that Net Q = CdT/dt = Qin - ( T - To) / thermal resistance.

The Attempt at a Solution



I can determine Qin by using 1ev = 1.602 X 10^-19 J. But I am stuck on how to proceed. Could someone please help?
 
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Obelisk said:

Homework Statement



A 50mm wafer, 2mm thick is implanted with Boron at 100keV and 1mA. Considering only conductive cooling, given that thermal resistance is 10K/W, to room temperature of 25oC, determine the steady state wafer temperature and also the time constant for heating

Homework Equations



I know that Net Q = CdT/dt = Qin - ( T - To) / thermal resistance.

The Attempt at a Solution



I can determine Qin by using 1ev = 1.602 X 10^-19 J. But I am stuck on how to proceed. Could someone please help?

Okay, how many Boron atoms are impinging on the wafer every second? How much energy do they (collectively) carry?
 
The boron atoms would collectively carry 100 X 1.602 X 10 ^ -19 J since 1 keV carries 1.602 X 10 ^ -19 J

How many atoms impinging per second is not given, is this something I can calculate from the information that has been provided in the question? If yes, what equation is required?

Thanks.
 
Obelisk said:
The boron atoms would collectively carry 100 X 1.602 X 10 ^ -19 J since 1 keV carries 1.602 X 10 ^ -19 J

How many atoms impinging per second is not given, is this something I can calculate from the information that has been provided in the question? If yes, what equation is required?

Thanks.

No, each boron atom carries 100 x 1.602E-19 J. As to the number, here's a hint: why do they tell you the implant current?
 
I think I am stalled, really stalled on this one! The only other piece of information that describes / models this physical situation would be:

T = To + (Tf - To) e ^(-t/tau).

I know that I am supposed to obtain Tf as the steady state wafer temperature and tau as the time heating constant. I am blocked, please help!
 

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