Thickness of thin film not affect electrical properties?

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SUMMARY

The discussion focuses on the impact of thin film thickness on the electrical properties of zinc oxide deposited on p-type silicon using sol-gel and spin coating techniques. It is established that achieving lattice matching is not feasible with spin coating, which affects the film's structural integrity. The consensus is that thinner films generally yield better structural properties, but the electrical behavior may not align with zinc oxide if the film thickness is not optimized. Additionally, large compressive or tensile stresses from processing can lead to significant issues such as wafer bowing and cracking.

PREREQUISITES
  • Understanding of thin film deposition techniques, specifically sol-gel and spin coating.
  • Knowledge of electrical properties related to Hall Effect measurements.
  • Familiarity with the concept of lattice matching in crystalline materials.
  • Awareness of the effects of mechanical stresses on thin films.
NEXT STEPS
  • Research the optimization of zinc oxide thin film thickness for electrical applications.
  • Learn about the effects of mechanical stresses on thin film integrity and performance.
  • Explore alternative deposition methods that allow for better lattice matching.
  • Investigate the relationship between film thickness and Hall Effect measurements in semiconductor applications.
USEFUL FOR

This discussion is beneficial for materials scientists, electrical engineers, and researchers involved in thin film technology and semiconductor device fabrication.

kimmylsm
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In deposition of thin film on a p-type silicon, how to make sure the thickness of the thin film will not affect or affect the least the electrical(Hall Effect) and structural properties? how to know how thick is the thin film that most suitable? can it be calculated? by the way, the thin film deposited is zinc oxide using sol-gel and spin coating(where thickness depend on speed are set)?
 
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You'd want to try to lattice match as close as possible and make sure the fermi levels line up approximately well. Structurally, the thinner the film the better. Electrically, I'm not sure since if it doesn't affect the silicon it won't be behaving like zinc oxide.
 
pseudophonist said:
You'd want to try to lattice match as close as possible

Lattice matching isn't possible here, even approximately. Lattice matching may occur when a crystalline film or structure is grown slowly on a substrate with (approximately) the same lattice constant. It will never occur with spin coating.

You do want to avoid large compressive or tensile stresses that can be created by further processing steps (perhaps this is what pseudophonist meant). Large film stresses can cause wafer bow, delamination, cracking, buckling, and so on.
 

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