- #1
lamejane
- 11
- 2
- TL;DR Summary
- Deposition rate reduction for Nickel- Microscopic effects
Hello Material experts out there !
I would like to test a reduced deposition rate for Ni ( 0.3 nm/sec reduced to 0.1 nm/sec) to avoid metal splashes and stabilize the process. This would for sure increase the deposition process time but I'm not quite sure of the Microscopic effects of such a change. Therefore a deeper insight ( scientific) would be helpful.
Questions:
What effect would a reduction in the deposition rate of Ni have on:
a. Crystal structure and Internal stress of deposited Ni thin film ?.
b. Adhesion of Ni thin-Film to suceeding layer ? (please refer to the schematic below)
c. Surface Roughness of Ni-thin film ?
d. Electrical and Thermal properties of the thin-film. ?
Thank you for your Inputs !
I would like to test a reduced deposition rate for Ni ( 0.3 nm/sec reduced to 0.1 nm/sec) to avoid metal splashes and stabilize the process. This would for sure increase the deposition process time but I'm not quite sure of the Microscopic effects of such a change. Therefore a deeper insight ( scientific) would be helpful.
Questions:
What effect would a reduction in the deposition rate of Ni have on:
a. Crystal structure and Internal stress of deposited Ni thin film ?.
b. Adhesion of Ni thin-Film to suceeding layer ? (please refer to the schematic below)
c. Surface Roughness of Ni-thin film ?
d. Electrical and Thermal properties of the thin-film. ?
Thank you for your Inputs !