EPVD: Effect of changing the Thin-film Metal deposition Rate

In summary, the individual is seeking input on the potential effects of reducing the deposition rate of nickel from 0.3 nm/sec to 0.1 nm/sec. They mention concerns about metal splashes and stability of the process, and are interested in the microscopic effects of this change. They specifically inquire about the impact on crystal structure and internal stress of the deposited nickel thin film, adhesion to the succeeding layer, surface roughness, and electrical and thermal properties. Regarding electrical properties, a decrease in deposition rate can lead to increased contamination from residual gases in the vacuum chamber. Generally, reducing the deposition rate can also decrease roughness of the film, but the specific effects under these conditions would require experimental confirmation.
  • #1
lamejane
11
2
TL;DR Summary
Deposition rate reduction for Nickel- Microscopic effects
Hello Material experts out there !

I would like to test a reduced deposition rate for Ni ( 0.3 nm/sec reduced to 0.1 nm/sec) to avoid metal splashes and stabilize the process. This would for sure increase the deposition process time but I'm not quite sure of the Microscopic effects of such a change. Therefore a deeper insight ( scientific) would be helpful.

Questions:
What effect would a reduction in the deposition rate of Ni have on:

a. Crystal structure and Internal stress of deposited Ni thin film ?.
b. Adhesion of Ni thin-Film to suceeding layer ? (please refer to the schematic below)
c. Surface Roughness of Ni-thin film ?
d. Electrical and Thermal properties of the thin-film. ?

pp.jpg


Thank you for your Inputs !
 
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  • #2
With regards to the electrical properties:

When reducing the deposition rate, the contamination of the growing film owing to the inclusion of or the reaction with residual gases in the vacuum chamber generally increases.

With regards to the morphology/microstructure:

Generally, for example, the roughness of the deposited films will decrease with decresing deposition rate. Some qualitative characteristics regarding the effect of the deposition rate on the morphology/microstructure of thin films can be found in [1]. Whether such effects play a role when changing the deposition rate from 0.3 to 0.1 nm/sec under your deposition conditions must be experimentally checked.

[1] “A Monte Carlo simulation of the physical vapor deposition of nickel” by Y.G.Yang, R.A.Johnson and H.N.G.Wadley (Acta Materialia, Volume 45, Issue 4, April 1997, Pages 1455-1468)
 
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1. What is EPVD?

EPVD stands for Electron-Beam Physical Vapor Deposition, which is a process used in thin-film deposition to create a metal coating on a substrate. It involves heating a metal source in a vacuum chamber until it evaporates and then condenses onto the substrate.

2. How does changing the thin-film metal deposition rate affect the final product?

The thin-film metal deposition rate directly affects the thickness of the metal coating on the substrate. A higher deposition rate will result in a thicker coating, while a lower deposition rate will result in a thinner coating. This can also impact the properties of the coating, such as its hardness and adhesion.

3. What factors can influence the thin-film metal deposition rate?

The thin-film metal deposition rate can be influenced by various factors such as the temperature of the metal source, the distance between the metal source and the substrate, the vacuum pressure in the chamber, and the power of the electron beam. These factors can be adjusted to control the deposition rate and achieve the desired thickness of the coating.

4. How can the thin-film metal deposition rate be measured and monitored?

The thin-film metal deposition rate can be measured using a quartz crystal microbalance, which measures the change in frequency of a quartz crystal as the metal coating is deposited on it. This method provides real-time monitoring of the deposition rate. Other techniques such as ellipsometry and profilometry can also be used to measure the thickness of the coating and indirectly determine the deposition rate.

5. What are some potential applications of EPVD and controlling the thin-film metal deposition rate?

EPVD and controlling the thin-film metal deposition rate have a wide range of applications in industries such as electronics, optics, and aerospace. It is used to create thin-film coatings with specific properties, such as conductivity, reflectivity, and durability, for various electronic and optical devices. It can also be used to create protective coatings on materials for aerospace applications, such as turbine blades and spacecraft components.

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