Out of curiosity I took a dead cell phone apart and can't help being puzzled at how the multitude of tiny components get onto the circuit board of the phone. A typical component size is 1mm X .5mm X .5mm. (smaller components were .5mm X .25mm X .25mm in size). Placement accuracy looked to be of order .1mm. Humans with really steady hands might do this but I'm guessing it is done by "robots"? Are the components greasy with some type of flux that makes them stick to the circuit board Or is the board covered in a thin layer of greasy flux to accomplish the same thing? How such tiny parts are made must be an interesting story. Thanks for any help!