Understanding Electroplating: Cu and Fe Ion Movement Explanation

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In the electroplating process involving copper (Cu) and iron (Fe), positively charged copper ions move toward the iron electrode due to copper's higher solubility compared to iron. This solubility allows copper to dissolve more readily, forming positive ions that migrate in solution. The discussion highlights that this movement is fundamental to the electroplating mechanism. The provided resource further explains the electroplating process in detail. Understanding these principles is essential for grasping the dynamics of ion movement in electroplating.
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In a Cu and Fe electroplaying process, why does the positively charged ions move from Cu to Fe instead of the other way round?
 
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jedishrfu said:
Not sure if this will answer your question:

http://www.explainthatstuff.com/electroplating.html

I think the basic answer though is that copper dissolves more easily than iron and so it becomes a positively charged ion in solution and migrates toward the iron electrode.

It indeed is of great help to me. Thanks!
 
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