Vias and feed throughs in PCB assembly are created primarily through a process called through-hole electroplating, which involves applying a solution inside the via and then plating over it. Alternative methods include using rivets or inserting copper wire through drilled holes, although these are more suited for prototypes and hobbyist projects. The traditional method involves drilling holes, soaking the board in an electrolyte, and then electroplating, often aided by ultrasound to ensure proper penetration and circulation of the electrolyte. While some speculative methods like using graphite dust have been mentioned, they are no longer commonly used. Understanding these techniques is essential for effective PCB design and assembly.