Abbreviation on material properties help -- what is h_ET, h_h, vP, V epspkt?

AI Thread Summary
The discussion revolves around the clarification of specific parameters related to a material model, including E-modul, yield stress, and various coefficients. h_ET likely refers to the elastic modulus in a viscoelastic context, while h_h may denote a characteristic related to viscosity. vP is probably the letter v, which could represent Poisson's ratio, and V epspkt likely indicates a volumetric strain parameter. The user seeks to confirm the units for E-modul, questioning if it is indeed 2000 MPa. Overall, the conversation focuses on understanding the definitions and units of these material characteristics in modeling.
WIN
Messages
48
Reaction score
10
material A:
E-modul:2000
yield stress:50MPa
h_ET:99
h_h:200
vP:20
V epspkt:0.99
parameter used for material characteristic curve n building of material model - (linear elastic, elastic plastic and viscoplastic model)
can someone explain to me what is h_ET, h_h, vP, V epspkt?
 
Last edited by a moderator:
Engineering news on Phys.org
From the look of "epspkt" this is probably not in English. Can you provide units where there are any, e.g. is "E-modul" 2000 MPa? Is h the letter h or the Greek eta (η), a common symbol for viscosity? Is v the letter v or the Greek nu (ν), a symbol for (among other things) Poisson's ratio?
 

Thread 'How could I make it so ferrofluid drops do not coalesce?'

Hello! I've been brainstorming on how to prevent a lot of ferrofluid droplets that are in the same container. This is for an art idea that I have (I absolutely love it when science and art come together) where I want it to look like a murmuration of starlings. Here's a link of what they look like: How could I make this happen? The only way I can think of to achieve the desired effect is to have varying droplet sizes of ferrofluid suspended in a clear viscous liquid. Im hoping for the...
View full post »

Thread 'How do you fabricate microfluidic chips in your lab?'

Hello everyone! I am curious to learn how laboratories handle in-house chip manufacturing using soft lithography for microfluidics research. In the lab where I worked, only the mask for lithography was made by an external company, whereas the mold and chip fabrication were carried out by us. The process of making PDMS chips required around 30 min–1 h of manual work between prepolymer casting, punching/cutting, and plasma bonding. However, the total time required to make them was around 4...
View full post »

Similar threads

Material Properties: Stress Strain Curve Analysis
Replies
7
Views
5K
Stress-Strain Graphs of different materials
Replies
9
Views
6K
Nature and Properties of materials
Replies
10
Views
8K
Could New Materials Propel China's Industry to Bill Gates-Level Success?
Replies
4
Views
10K
Ductile material engineering stress-strain curve
Replies
3
Views
5K
Strange behaviour of viscoelastic materials
Replies
1
Views
2K
ANSYS Mechanical APDL - High Temperature Creep Modeling via Isochronous Curves
Replies
1
Views
5K
How do I calculate the bending moment and maximum load for a cantilevered stud?
Replies
7
Views
15K
Understanding propagation loss: What does this output mean?
Replies
18
Views
5K
I What Key Issues Should Cosmologists Address in the ΛCDM Model?
Replies
1
Views
3K

Hot Threads

Recent Insights

Back
Top