Coating Hollow Shapes w/ Vacuum Evap: Atom vs Ion?

AI Thread Summary
Vacuum evaporation, sputtering, and ion plating can be used to coat the inside walls of holes and hollow shapes, but they face significant technical challenges due to line-of-sight limitations. The source materials in these processes can be ejected as atoms or ions, with the transport mechanism varying by method. While many textbooks suggest atoms are used, the question of how they reach the substrate without charge remains complex. Chemical Vapor Deposition (CVD) and Atomic Layer Deposition (ALD) are also viable alternatives for achieving uniform coatings in difficult geometries. Overall, while challenges exist, there are multiple approaches to effectively coat hollow substrates.
kelvin490
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Is it possible to use vacuum evaporation, sputtering and ion plating processes to coat the inside walls of holes and other hollow shapes of substrates? I wonder whether the source materials are ejected in the form of atoms or ions? Many books say atom but how can they travel to the substrate if they don't have charge?

I have looked for several textbooks but cannot get a confirmed answer.
 
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Thanks for the post! Sorry you aren't generating responses at the moment. Do you have any further information, come to any new conclusions or is it possible to reword the post?
 
Yes, but lots of technical challenges. Most vacuum deposited coating are line of sight, but lots of ways to skin a cat.

CVD might be considered.

Your question on ions or atoms, which process type? Fundamental are available in all over the place.
 
ALD is the best choice.
 

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