HfO2 is a potential dielectric material, but its local crystallization at temperatures around 700-800°C leads to instability in electrical properties. This temperature range is critical as it falls below the requirements for most semiconductor annealing processes. The implications of this crystallization could limit the practical use of HfO2 in semiconductor applications. Conducting AFM measurements indicate that current detection through the dielectric varies in degree, highlighting concerns about uniformity. Overall, the crystallization of HfO2 poses significant challenges for its reliability as a dielectric material in high-temperature environments.