Crystallization of HfO2: Impact on Dielectric Properties below 700-800 C

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HfO2 is a potential dielectric material, but its local crystallization at temperatures around 700-800°C leads to instability in electrical properties. This temperature range is critical as it falls below the requirements for most semiconductor annealing processes. The implications of this crystallization could limit the practical use of HfO2 in semiconductor applications. Conducting AFM measurements indicate that current detection through the dielectric varies in degree, highlighting concerns about uniformity. Overall, the crystallization of HfO2 poses significant challenges for its reliability as a dielectric material in high-temperature environments.
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HfO2 is considered to be used as a dielectric but if it crystallizes locally its electrical properties becomes unstable. This happens around 700-800 C, which is below where most semiconductor anneals require. Shouldn't this preclude its use?
 
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http://www.electrochem.org/meetings/scheduler/abstracts/210/1129.pdf
 
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Thanks for the paper link, very interesting. The conducting AFM is telling, since it always detects current through the dielectric, just a matter of degree of uniformity.
 

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