The discussion centers on the optimal gap between the plates of a Thermoelectric Module (TEM) and its impact on performance. A wider gap increases ohmic resistance, leading to higher heat deposition and reduced cooling efficiency, while a narrower gap risks back heat transfer from the hot to the cold plate. The ideal design balances these factors, as shorter elements can enhance heat throughput and power output despite lower efficiency. Effective cooling strategies, such as using a finned heat sink or fans, are crucial for maximizing the module's performance. Ultimately, addressing cooling challenges is more critical than merely increasing the thickness of the TEM.