Heat simulation in electrical/mechanical engineering

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SUMMARY

The discussion centers on the use of simulation software for addressing heat-related issues in electrical and mechanical engineering, specifically regarding thermal cracks on alumina substrates during furnace firing and cooling processes. The user has experience with ANSYS Fluent but is seeking alternative software options due to licensing constraints. OpenFOAM is mentioned as a potential alternative for simulating thermal issues.

PREREQUISITES
  • Understanding of thermal simulation concepts in engineering.
  • Familiarity with ANSYS Fluent for thermal analysis.
  • Knowledge of OpenFOAM and its application in heat simulation.
  • Basic principles of thermal stress and material behavior under heat.
NEXT STEPS
  • Research the capabilities of OpenFOAM for thermal simulations.
  • Explore alternative simulation software such as COMSOL Multiphysics.
  • Learn about thermal crack analysis techniques in materials science.
  • Investigate best practices for furnace firing and cooling processes in engineering.
USEFUL FOR

Engineers and researchers in electrical and mechanical fields, particularly those dealing with thermal management and material integrity during manufacturing processes.

Ash.K
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Hi all,

I was wondering if anyone uses simulation software's to tackle the heat related issues in electrical/mechanical engineering?

Regards
 
Engineering news on Phys.org
Welcome to PF!

This question is very vague, so I would have to just answer yes. If you ask a more specific question, I may be able to provide a more specific answer.
 
russ_watters said:
Welcome to PF!

This question is very vague, so I would have to just answer yes. If you ask a more specific question, I may be able to provide a more specific answer.
Hi Russ,
Thanks for your reply. I am having a lot of thermal cracks on alumina substrates during furnace firing/cooling of conductor/dielectric pastes. So, I wanted to know if there were any software's that could be used to simulate the issue. I have used ANSYS Fluent for simulation of wire annealing but since my company don't have a license for it, I was trying to learn if there are any other software's that can be used. i.e OpenFOAM?
 

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